TDI partnered with the leader in the manufacturing of equipment, tools and materials that are used in the production of a wide range of semiconductor devices.
A custom unit was developed for use in High Speed Ball Bonders that wire silicon ICs to pins in an IC package with very fine gold wire and placement precision down to the micron level. TDI supplied a multi-output power supply with voltages ranging from 5VDC to 400VDC with AC outputs as well.
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